Highfive Rigid-Flex PCB
Rigid-Flex PCB Prototypes and NPI, Pilot, Mix-production Based on Cheap Cost
Rigid-Flex boards are boards using a combination of flexible and rigid board with technologies.
Most rigid-flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.
Rigid-Flex designs are more challenging than the designs of those typical rigid board application, as the rigid-flex boards are designed in a 3D space, which also with greater spatial efficiency.
By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board to achieve their desired shape for the final application’s package.
Rigid-Flex PCBs Fabrication Applications
Rigid-Flex PCBs offer a wide array of applications, ranging from smart devices to cell phones and digital cameras. Increasingly, rigid-flex board fabrication has been used in medical devices such as pacemakers for their space and weight reduction capabilities. The same advantages for rigid-flex PCB usage can be applied to smart control systems.
In consumer products, rigid-flex doesn’t just maximize space and weight but greatly improves reliability, eliminating many needs for solder joints and delicate, fragile wiring that are prone to connection issues. These are just some examples, but Rigid-Flex PCBs can be used to benefit nearly all advanced electrical applications including testing equipment, tools and automobiles.
Rigid-Flex PCBs Technology and Production Process:
Whether producing a rigid flex prototype or production quantities requiring large scale Rigid-Flex PCBs fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.
Careful consideration of Rigid-Flex solutions and a proper assessment of the available options at the early stages in the rigid-flex PCB design phase will return significant benefits. The Rigid-Flex PCBs fabricator must be involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.
The Rigid-Flex manufacturing phase is also more complex and time-consuming than rigid board fabrication. All the flexible components of the Rigid-Flex assembly have completely different handling, etching, and soldering processes than rigid FR4 boards.
Highfive Rigid-flex Capabilities
Benefits of Rigid-Flex PCBs
• Space size can be minimized
• By removing the connectors and cables between rigid parts, the board size and overall system weight can be reduced.
• By maximizing space usage but with few parts.
• Few solder joints but with higher connection reliability.
• Handling of assembly is easier in comparison with normal.
• Simplified PCB assembly processes.
• Integrated ZIF contacts provide simple modular interfaces to the system environment.
• Test conditions are simplified. A complete test before installation becomes possible.
• Logistical and assembly costs are significantly reduced with Rigid-Flex boards.
• It is possible to increase the complexity of mechanical designs, which also improves the degree of freedom for optimized housing solutions.
Check Highfive Rigid-Flex PCB manufacturing capabilities in the following table:
Rigid Board Capacities of Construction
Minimum core thickness: 0.003″
* Minimum prepreg: 0.002″
* Public : Registered : Special
* Mixed dielectrics
* Controlled dielectrics
* Controlled impedance
* Impedance Layer Stack-up
* Blind via, buried via
* Silver Filled Via holes
* Min. PCB thickness 0.010″
* Max. PCB thickness 0.283″ (7.2mm)
Rigid Board Capabilities of Surface Finishing
HASL ( Hot Air Solder Leveling)
Soft Bondable Gold
Electronlytic Gold (Knoop Hardness 120 or <)
Soft Electrolytic Gold (Knoop Hardness 90 or <)
OSP (Organic Solderability Preservative)
Rigid Board Materials Processing
Via Hole Filled (Plated shut)
Via Hole Filled (CB100 Silver)
Rigid Capabilities for PCB Processes
1. Min Line Trace Width (Outer and Inner) 3 mil
2. Min Line Space (Outer and Inner) 3 mil
3. Max Layer Count 40
4. Min Hole Diameter 6 mil/ laser Drilling Hole Diameter 1mil
5. Min. HWTC (mil) 7 mil
6. Hole Location Dimension 2 mil
7. Fabrication Radius +/5 Degrees
8. Warpage/Inch 3 mil
9. Solder-mask Space 3 mil
10. NPTH Hole Size Tolerance 1 mil
11. Peel-able Testing 1.4N/mm
12. Max. Aspect Ratio 12:1
13. SMT Pitch/BGA Pitch (mil) 18 mil /12 mil
14. Plating Thickness (1).Plating Ni Thickness：2.5~5um.
(2).Plating Au Thickness：0.05~2um (per client)
15. Registration Layer-to-layer 2 mil
16. Impedance Control +/-7%(5%)
17. Blind & Buried Yes
18. HDI 3+N+3, N+N
19. Base Copper 1/3,…, 6 OZ, 4 OZ with UL
20. Copper Thickness (Outer) 5 OZ
21. Registration Layer to Layer 3 mil
22. Max Board Thickness 120 mil
23. Board Thickness Tolerance 5%
24. Lead-free HASL 2-5 um or Per customer requirements
25. ENIG 0.03-0.15um
26. Flash Gold 0.05-0.1 um
27. Thick Gold 0.1-2.0 um
28. Immersion Silver 0.1-0.5 um
29. Immersion Tin 0.8-1.2 um
30. OSP 0.1-0.5um,ENTEK
31. Selective Gold Plating Per customer requirements
32. Selective OSP/HASL Per customer requirements