Rigid Board Capabilities

Rigid board Capabilities for Material

Rogers, 4003, 4350, Rogers+FR-4 Hybrid

Nelco 4000 Series

Per IPC-4101

Multi-functional FR-4

FR-406, FR-408, IS410, 370HR

FR-4 Tg,Hi-Tg,Halogen-free,BT Epoxy,Teflons,

Arlon,Taconics,RCC,Cyanate Ester,Polyimide,

Nelcon,Getek,Allied 408,CEM3,ceramic,PTFE, etc.

Rigid Board Capacities of Construction

Minimum core thickness: 0.003″

* Minimum prepreg: 0.002″

* Public : Registered : Special

* Mixed dielectrics

* Controlled dielectrics

* Controlled impedance

* Impedance Layer Stack-up

* Blind via, buried via

* Silver Filled Via holes

* Min. PCB thickness 0.010″

* Max. PCB thickness 0.283″ (7.2mm)

Highfive Rigid-flex PCB

Rigid Board Capabilities of Surface Finishing

HASL ( Hot Air Solder Leveling)

Immersion Silver

Immersion Gold

Soft Bondable Gold

Electronlytic Gold (Knoop Hardness 120 or <)

Soft Electrolytic Gold (Knoop Hardness 90 or <)

OSP (Organic Solderability Preservative)

Highfive 8L Rigid Board ENIG Fine BGA PCB

Highfive 8L RIGID BOARD ENIG Fine BGA PCB

Rigid Board Materials Processing

Via Hole Filled (Plated shut)

Via Hole Filled (CB100 Silver)

Highfive PCB

Rigid Capabilities for PCB Processes

1. Min Line Trace Width (Outer and Inner) 3 mil

2. Min Line Space (Outer and Inner) 3 mil

3. Max Layer Count 40

4. Min Hole Diameter 6 mil

5. Min. HWTC (mil) 7 mil

6. Hole Location Dimension 2 mil

7. Fabrication Radius +/5 Degrees

8. Warpage/Inch 3 mil

9. Solder-mask Space 3 mil

10. NPTH Hole Size Tolerance 1 mil

11. Peel-able Testing 1.4N/mm

12. Max. Aspect Ratio 12:1

13. SMT Pitch/BGA Pitch (mil) 18 mil /12 mil

14. Plating Thickness (1).Plating Ni Thickness:2.5~5um.

(2).Plating Au Thickness:0.05~2um (per client)

15. Registration Layer-to-layer 2 mil

16. Impedance Control +/-7%(5%)

17. Blind & Buried Yes

18. HDI 3+N+3, N+N

19. Base Copper 1/3,…, 6 OZ, 4 OZ with UL

20. Copper Thickness (Outer) 5 OZ

21. Registration Layer to Layer 3 mil

22. Max Board Thickness 120 mil

23. Board Thickness Tolerance 5%

24. Lead-free HASL 2-5 um or Per customer requirements

25. ENIG 0.03-0.15um

26. Flash Gold 0.05-0.1 um

27. Thick Gold 0.1-2.0 um

28. Immersion Silver 0.1-0.5 um

29. Immersion Tin 0.8-1.2 um

30. OSP 0.1-0.5um,ENTEK

31. Selective Gold Plating Per customer requirements

32. Selective OSP/HASL Per customer requirements

Highfive Quick Turn PCB Prototype