Flexible Board Capabilities 

1. Flexible Board Material : Low Flow PP, PET. etc.

2. Build-up Material:PI Bond Ply, etc.

3. Layer Count: 10  or higher

4.   Copper Foil: 1/3,…,2OZ,

5. Standard Panel Size: 250*400(mm)

6.  Min. Line Width/Space:  3mil

7. Minimum Rilling (Mechanical ) Hole Diameter: 8 mil

8. Minimum Via (Laser) Hole Size Diameter:  5 mil

9. Minimum Micro Via (Laser) Hole Size Diameter: 3 mil

10. Stiffener Material: Polyimide/FR4/Metal

11. PI Stiffener Registration: 10 mil

12. PI Thickness Tolerance:10%

13. FR4 Stiffener Registration:10 mil

14. FR4 Thickness Tolerance: 10%

15. Shielding Material: Copper/Silver Ink/Tatsuta/Carbon

16.  Tooling Tolerance: 2 mil

17. Zif Tolerance: 2 mil

18. Coverlay Registration: 8 mil

19. PIC Registration: 7 mil

20. Solder Mask Registration: 5 mil

21.  Flexible Board Impedance Control: +/-10%   &  7%

22. Flexible Board  Max Aspect Ratio (Thr. Hole) :    8:1

23. Flexible Board Min. SM Opening :2 mil

24:  Solder Mask Bridge Between Dam: 5 mil

25. Solder Mask Registration Tolerance: 4 mil

26.  Type of Surface Finish: OSP, Selective OSP, Flash Gold, Thick Gold

27. Legend Minimum Height: 35 mil

28. Legend Minimum Width: 8 mil

29. Legend Minimum Space: 8 mil

30. Legend Registration +/-5 mil

SRD( Steel Rule Die)

 31.  Outline Tolerance: 4 mil/ or 2 mil

32. Minimum Radius: 5 mil

33. Minside Inside Radius:20 mil

34. Punching Minimum Hole Size: 40 mil

35. Punching Hole Size Tolerance +/-2 mil

36. Slot Minimum Width: 20 mil ,  V-cut and Routing Tolerance:  6 mil

37.Tolerance for Hole Outline : +/-3 mil

38. Tolerance for Hole Edge :+/- 4 mil

39. Minimum the distance between Trace to Outline: 8 mil

There are some details for FPC which is relevant to Rigid-Flex PCB, you can contact us for more. Or you can join to the Rigid-Flex Group to get much more.

 

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