Cutting-edge PCB Fabrication

 

You can find our specialties as below for our cutting edge PCB fabrication processes:

-Inner Layer Material Cutting

-Inner Dry Film

Dry Film Lamination

-Black Oxidation

-Brown Oxidation

-Lay up

-Pressing

-CNC Drilling Machine

-Plating Electroless Copper, PTH, Panel Plating

-Dry Film Lamination

-Pattern Plating

-Pre-Treatment

-Dry Film Developing

-Etching

-Solder Mask

-Component Marking

-Profiling

-Routing Machine

Routing Capabilities

-Punching

-E-Testing

-Surface Finishing:

ENIG

Immersion Tin

Immersion Silver

Flash Gold

Thick Gold

Selective Plating Gold

OSP/Selective OSP

Flux

HASL/Lead-free HASL/Selective HASL

-Electronic Testing

-PCB Assembling

(SMT, DIP, Wave-soldering, Soldering)

Cutting-edge X-Ray 3D Inspection

SMT : Universal & FUJI High-speed placement,YAMAHA low volume/high mix

Fine Pitch/Odd Form Placement: Universal

Force Convection Reflow: Heller

Fine Pitch/BGA Re-work: Conceptronics Freedom

Thru-Hole Lines: Universal

Wave Solder Machines

Solder Paste Inspection (AOI)

Selective Soldering

X-Ray Inspection System

In-circuit Test: Agilent Series

Automated Optical Inspection

Product specific functional testing

Highfive Cutting Edge

 

Cutting Edge with Our Experts Rich Experience as Free Supporting

 

Range of volume requirements from low-volume complex, custom products to high-volume standard products.

Free Supporting from your Design and Layout to Box-Building, Testing and Shipping.

Our lead times can be as short as one week for standard products.

PCBA project management, design, documentation and artwork generation by using the latest software technologies to produce the highest quality products.

Our Program Managers and Engineers are experts in CAD, Allegro, PADS, Mentor and CCT for PCBA layout.

We can provide the free supporting at any time during your projects if we can.

Our engineers can perform layout from the customer’s schematic and will perform a Design For Manufacturing (DFM), Design For Test (DFT), and cost reduction review.

With  EMI  Rich Experience.

We can also modify any existing drawing to customer specification.

Our facilities maintain high quality ISO 9000 standards.

This commitment to quality means our customers receive the highest quality products worldwide.

 

Capabilities Based On Our Experience and Cutting Edge

 

We have experience in many methods of printed circuit board assembly, from thru-hole and mixed technology to customized fine pitch surface mount technologies.

Highfive breadth of manufacturing services and in-house testing capabilities keep product costs down, ensure product security and meet time to market requirements.

Our unique blend of high caliber design, engineering and manufacturing services, flexibility and responsiveness to customer needs and ability to provide a full range of

product testing services have positioned as a leader in the highly-competitive global electronic manufacturing services marketplace.

 

 

Making a printed circuit brings together chemistry, engineering, photography and mechanical,IT, in a series of processes to turn design into reality, as the basic building

block of almost anything electronic.

 

It requires skills, experiences and investments to produce a bespoke design very quickly and to an exemplary quality standard, only then can the project, be it a new

product or mass production, be allowed to proceed.

 

Capabilities Based on Continual Investment and Cutting Edge Updating

 

We continually invest in equipment, training and support, which allows us to exceed expectations and to get PCB boards out in minimum time.

In our drilling area we have high speed auto-loader machines that will drill holes down to 0.1 mm with great accuracy and speed. Our Bonding press bonds at vacuum of 1

mbar to give excellent encapsulation and thickness control, even at the highest layer count.

Automatic inspection finds the smallest error, to ensure top class yield when we put a printed circuit board on our roving probe testers, testing to the design data.

Laser photo-plotting and UV printing can define features to 75 microns, and precision etching, combined with first-class layer to layer tolerances, gives excellent impedance matching.

We metallize and plate substrates from PTFE to polyimide, and apply a full range of solderable final finishes, including immersion gold, lead free HAL, sterling silver and

OSP.

 

We score, rout and mill to profile, including contouring aluminium base, and even anodize the back of aluminium boards for fantastic thermal properties.

 

All this is done by a workforce with great skills, most of whom have many years’ experience in making printed circuits; this means we can advise on the best way to get the

best board possible on your assembly machines in the shortest time possible.

Highfive Cutting Edge Lines
Highfive Cutting Edge Drilling

 

State-of-the-art facilities and Cutting Edge

 

Highfive maintains a state-of-the-art facilities to keep up with increasing demands of quality and production volume. This is not an inclusive list, but it shows our intent to maintain a modern facilities.

-Inner Layer Material Cutting

-Inner Dry Film

Dry Film Lamination

-Black Oxidation

-Brown Oxidation

-Lay up

-Pressing

-CNC Drilling Machine

-Plating Electroless Copper, PTH, Panel Plating

-Dry Film Lamination

-Pattern Plating

-Pre-Treatment

-Dry Film Developing

-Etching

-Solder Mask

-Component Marking

-Profiling

-Routing Machine

Routing Capabilities

-Punching

-E-Testing

-Surface Finishing:

ENIG

Immersion Tin

Immersion Silver

Flash Gold

Thick Gold

Selective Plating Gold

OSP/Selective OSP

Flux

HASL/Lead-free HASL/Selective HASL

-Electronic Testing

-PCB Assembling

(SMT, DIP, Wave-soldering, Soldering)

-PCBA Testing

-Box-build

-Final Audit

Please contact us for more updating details, or get some info from our HIDEISGN.