Aluminium Substrate PCB
Aluminium PCB, the aluminum base plate is one of metal base clad copper plate with good heat dissipation function.
The single panel is composed of three layers, the circuit layer (copper foil), the insulating layer and the metal base.
For high-end use, there are also designed as double sided board, of multilayers.
The structure is circuit layer, insulation layer, aluminum base, insulation layer, circuit layer, etc.
Multilayer Aluminium PCB
A small number of applications are with multilayer PCB.
Which can be made of ordinary multilayer plates and insulating layers and aluminum base.
It has good thermal conductivity, electrical insulation and mechanical properties.
Aluminum substrate withstand pressure of up to 4500V, thermal conductivity of more than 200 W/(M.K).
Aluminium PCB Thermal conductivity
The coefficient of thermal conductivity of pure aluminum is fixed.
The thermal conductivity of the aluminum base material is related to the amount of other material on the aluminum substrate material!
If copper, silver and other high thermal conductivity materials are added, the thermal conductivity of aluminum substrate material must be higher.
Thermal conductivity depends on the degree of aluminum, and the intermediate insulating layer material.
The fifth degree is about to the 135W/mK.
The third degree is about to 150W/mK.
The first degree is about to 220W/mK.
The ordinary aluminum substrate PCB with guide below 100W/mK.
High conductivity is about 150W~400W/mK.
There are thermal 220W/mK on the market at present, the insulation layer is DLC.
The thermal conductivity of the aluminum substrate is from 100 to 400 W/(M.K)
Thermal conductivity for heat transfer exists in the form of heat conduction.
There are other forms of heat transfer form, compound heat transfer relationship such as radiation, convection and mass transfer.
The property is often referred to as apparent conductivity, dominant thermal conductivity or effective thermal conductivity (thermal transmissivity of material).
In addition, the coefficient of thermal conductivity for homogeneous materials, the actual situation, there is a porous, multi-layer, multi structure, anisotropic materials, thermal conductivity of the material is actually a comprehensive thermal performance, also known as the average coefficient of thermal conductivity
Aluminium Thermoelectric separation
The high performance of high thermal conductivity aluminum plate, copper plate, copper and aluminum composite plate, COB mirror aluminum, thermoelectric separation structure of the processing technology, better solve some high power LED lamp heat problem.
Especially to provide better heat dissipation for high power 100 watt -1000 watt LED lighting products.
Products are widely used in LED lighting, high-power power supply, automotive, power, electronics, medical equipment, machinery and equipment and other fields.
Four differences between copper clad plate and aluminum base plate
1. Heat dissipation
The heat dissipation of aluminum base plate is higher than that of copper composite plate. The heat dissipation of aluminum base plate and its insulation layer density, thermal conductivity, the thinner the insulation layer, the higher the thermal conductivity.
2. Mechanical function
Compared with copper clad laminate, aluminum substrate is better than copper clad laminate. The aluminum substrate has high mechanical strength and resistance, so it can be printed on the aluminum substrate.
3. Electromagnetic shielding function
Aluminum substrate can be used as shielding plate to shield electromagnetic wave, but it is better than copper clad plate.
4. Coefficient of thermal expansion
Because the general copper cladding has the question of thermal expansion, it is easy to affect the quality of metal holes and wires. The coefficient of thermal expansion of aluminum substrate is less than that of copper composite board, which helps to ensure the quality and reliability of printed circuit board.
Composition of aluminum substrate
The circuit layer (usually electrolytic copper foil) is etched to form a printed circuit, which is used for the assembly and connection of devices. Compared with the traditional FR-4, the aluminum substrate can carry higher current with the same thickness and linewidth.
Insulating layer is the core technology of aluminum substrate, which mainly plays the functions of bonding, insulation and heat conduction. The insulating layer of aluminum substrate is the largest heat conduction barrier in the power module structure. The better the heat conduction performance of the insulating layer is, the more conducive to the diffusion of the heat generated during the operation of the device, the more conducive to reduce the operating temperature of the device, so as to achieve the purpose of increasing the power load of the module, reducing the volume, extending the service life and improving the power output.
What kind of metal is used for insulating metal substrate depends on the comprehensive consideration of the thermal expansion coefficient, thermal conductivity, strength, hardness, weight, surface state and cost of the metal substrate.
Generally, considering the cost and technical performance, aluminum plate is the ideal choice. There are 606150521060 aluminum plates available. If there are higher requirements for heat conduction performance, mechanical performance, electrical performance and other special performance, copper plate, stainless steel plate, iron plate and silicon steel plate can also be used.